IUS TPC Committee Member

Posted
1 year ago
This is a volunteer position.

Job Menu

Description

Position Title: TPC Committee Member
UFFC-S Committee: IEEE UFFC-S IUS Technical Program Committee Groups 1-5
Experience Level: Experienced Professional
Position Description:

The IEEE UFFC-S International Ultrasonics Symposium Technical Program Committee (TPC) plays a key role in the organization of the UFFC Society’s premier meeting, the IEEE International Ultrasonics Symposium. As part of this process, TPC members actively contribute to a number of operations. Key activities include objective reviews of abstract submissions, selection of invited speakers, organization of the student paper competition, assembly of the conference program schedule, and planning of special sessions.

There are five TPC groups categorized by technical expertise. This call is seeking new members to join the TPC groups 1-5. Applications will be accepted until 12 January 2024. We are particularly interested in candidates who will bring expertise to one or more of the Ultrasonics technical disciplines for TPC groups 1-5 (shown here) and those who will show a strong commitment to contribute to the IEEE UFFC IUS and various committee operations.

Qualified candidates from academia and/or industry are welcome to apply. Selection criteria are listed hereunder. Particular attention will be paid to improving the balance between male/female, and industry/academia representatives as well as to improve geographic diversity and coverage among TPC members. Candidates will be informed of the results by the 31 January 2024.

Selection Criteria:
Essential

  • Previous experience of attendance, presenting, and/or technical contribution at international conferences
  • Demonstration of knowledge and profession in their field through conferences, journal publications, and patents.
  • A Ph.D. and 5+ years of experience, or equivalent, in a field related to UFFC-S
  • IEEE UFFC-S membership

Desirable

  • Prior service and engagement in the UFFC-S activities

Technical Disciplines

Group 1: Medical Ultrasonics
•    Medical Beamforming and Beam Steering (MBB)
•    Biological Effects & Dosimetry (MBE)
•    Blood Flow Measurement (MBF)
•    Contrast Agents (MCA)
•    Elasticity (MEL)
•    Medical Imaging (MIM)
•    Medical Image and Signal Processing (MIS)
•    Medical Photoacoustics (MPA)
•    System & Device Design (MSD)
•    Medical Tissue Characterization (MTC)
•    Therapeutics, Hyperthermia, and Surgery (MTH)
•    Theranostics (MTN)
•    Super Resolution (MSR)

Group 2: Sensors, NDE & Industrial Applications
•    Acoustic Microfluidics (NAF)    
•    Acoustic Imaging and Microscopy (NAI)    
•    Acoustic Sensors (NAS)    
•    General NDE Methods (NDE)    
•    Energy Harvesting (NEH)    
•    Flow Measurement (NFM)    
•    Material & Defect Characterization (NMC)    
•    Photoacoustics (NPA)    
•    Process Control and Industrial Ultrasound (NPC)   
•    Signal Processing (NSP)    
•    Transducers: NDE and Industrial (NTC)    
•    Underwater Acoustics (NUA)    
•    Wave Propagation (NWP)    
•    Structural Health Monitoring (NSH)    

Group 3: Physical Acoustics
•    General Physical Acoustics (PGP)
•    Acoustic Tweezers and Particle Manipulation (PAT)
•    Nonlinear Physical Acoustics (PNL)
•    Temperature effects; High Power; Non-Reciprocal Acoustics (PTE)
•    Opto-Acoustics (POA)
•    Modelling and Inversion (PMI)
•    Phononics (PPN)
•    Thin Films (PTF)
•    Ultrasonic Motors & Actuators (PUM)
•    Physics of Biological Ultrasound (PBU)

Group 4: Microacoustics – SAW, FBAR & MEMS
•    Device Applications (ADA)
•    Device Modeling and Design (ADM)
•    Materials and Propagation (AMP)
•    Microacoustic Resonators (AMR)
•    Microacoustic Sensors (AMS)
•    Novel Microacoustic Devices (ANM)
•    Acoustic Wave Filters (AWF)

Group 5: Transducers & Transducer Materials
•    Micromachined Ultrasonic Transducers (TMU)
•    Biomedical Diagnostic and Imaging Transducers (TMI)
•    Biomedical Therapeutic Transducers (TTT)
•    Piezoelectric and Other Materials (TPM)
•    Applications of Piezoelectrics and Ferroelectrics (TPF)
•    Thin and Thick Piezoelectric Films (TFT)
•    Front-end and Integrated Electronics (THF)
•    Integrated Electronics and Systems (TIS)
•    Modeling and Simulation (TMS)