Philip Feng is a Professor in ECE at University of Florida. He received Ph.D. in Electrical Engineering from California Institute of Technology (Caltech) in 2007. His research has primarily focused on resonant micro/nanoelectromechanical systems (MEMS/NEMS), especially those based on low-dimensional (2D, 1D) materials, advanced semiconductors (SiC, III-nitrides, oxides), as well as other solid-state electronic/photonic structures, quantum devices, and integrated systems. He has graduated over 10 Ph.D. researchers and 8 M.S. students with thesis research. He is an associate editor for IEEE Transactions on Ultrasonics, Ferroelectrics & Frequency Control (T-UFFC). He has served on Technical Program Committees (TPCs) and as Track/Session Chairs for IEEE IFCS & EFTF, IEDM, MEMS, Transducers, SENSORS, etc. He served as a chair for IEEE MEMS 2021.