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scia Systems is a full-range supplier of advanced ion beam and plasma processing equipment. The systems are applicable for etching (e.g., delayering of dies), trimming (e.g., surface correction of filter devices), and coating (e.g., temperature compensation films) processes in the production of microelectronics and MEMS. Our process equipment achieves Angstrom precision in frequency, surface, and thickness trimming, in manufacturing of BAW and SAW devices. The industry-proven scia Trim 200, enables ion beam trimming of functional layers in compound wafers, which leads to excellent material properties. Due to their flexible and modular design, the systems can be configured according to customer-specific requirements for both, high volume production as well as research and development environments. Together with our worldwide service partners, we offer comprehensive service and superior technology support.