Student Paper Competition Awards at the 2019 IEEE International Ultrasonics Symposium

January 6, 2020 | Contributed By - Erdal Oruklu, Ultrasonics News Editor

The 19th IUS Student Paper Competition was held during the 2019 IEEE International Ultrasonics Symposium in Glasgow, Scotland. The award consists of a certificate and represents a prestigious recognition of the student’s achievement. Abstracts submitted by students for the Student Paper Competition were reviewed by the Technical Program Committee (TPC) members. Based on this review, 18 student finalists were selected (6 from Medical Ultrasound and 3 from each of the remaining technical groups: Sensors, NDE & Industrial Applications; Physical Acoustics; Microacoustics-SAW, BAW, MEMS; and Transducers & Transducer Materials).

The finalists were notified and asked to prepare a poster of their papers to be displayed for the duration of the symposium. All finalists received travel support to help them to attend the conference. At the time of the poster presentation, the finalist was required to be a registered member of IEEE and UFFC.

2019 Student Paper Competition Finalists at the SEC, Glasgow, Scotland

Student finalists were then evaluated during a special poster section by a panel of judges (representing the papers’ technical group) on the first day of the symposium. Six winners were announced during the awards ceremony which took place at the Scottish Event Centre (SEC), Glasgow.

The 2019 Student Paper Competition winners are:

  • Medical Ultrasonics

Christopher Pacia, Washington University, St. Louis, MO, USA

“Feasibility and Safety of Focused Ultrasound-Enabled Brain Tumor Liquid Biopsy (FUS-LBx) in a Porcine Model”

Christopher Pacia receiving the best student paper award from Lori Bridal and John Hossack, 2019 IEEE IUS Technical Program Co-Chairs.

  • Medical Ultrasonics

Stephen Alexander Lee, Columbia University, NY, USA

Nerve displacement mapping for human peripheral neuromodulation”

Stephen Lee receiving the best student paper award from Lori Bridal and John Hossack, 2019 IEEE IUS Technical Program Co-Chairs.

  • Sensors, NDE & Industrial Applications

Boyang Wang, Illinois Institute of Technology, Chicago, Illinois, USA

A High-Performance Ultrasonic System for Flaw Detection”

Boyang Wang receiving the best student paper award from Lori Bridal and John Hossack, 2019 IEEE IUS Technical Program Co-Chairs.

  • Physical Acoustics

Ye Yang, Chinese Academy of Sciences, Shenzhen, China

“3D Acoustic Tweezers Based on Time Reversal”

Ye Yang receiving the best student paper award from Lori Bridal and John Hossack, 2019 IEEE IUS Technical Program Co-Chairs.

  • Microacoustics-SAW, BAW, MEMS

Yansong Yang, University of Illinois at Urbana-Champaign, Urbana, IL, USA

“A C-Band Lithium Niobate Filter with 10% Fractional Bandwidth for 5G Front-end”

Yansong Yang receiving the best student paper award from Lori Bridal and John Hossack, 2019 IEEE IUS Technical Program Co-Chairs.

  • Transducers & Transducer Materials

Christopher Cheng, Penn State University, PA, USA

“Thin Film PZT-Based PMUT Arrays for 1D Microparticle Manipulation & Imaging Applications”

Christopher Cheng receiving the best student paper award from Lori Bridal and John Hossack, 2019 IEEE IUS Technical Program Co-Chairs.